Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...
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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques
Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and ...
TL;DR: Intel's cancelled Battlemage GPUs featured innovative 3D-stacked Adamantine cache, promising enhanced performance similar to AMD's Infinity Cache. Despite ambitious designs with up to 40 Xe2 ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
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