In recent years, 3D printing has captured the imagination of innovators across a wide array of industries, and the packaging sector is no exception. As brands seek smarter, more sustainable ways to ...

Additive manufacturing, commonly known as 3D printing, is transforming the way products are designed, produced, and distributed. As this technology advances, the need for specialised packaging ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) -- The "3D Semiconductor Packaging Market Report 2026" has been added to ResearchAndMarkets.com's offering. This report provides a thorough insight into the ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024, entering the ...

In the realm of advanced medical device development, Switzerland’s Oertli Instrumente AG has transformed its prototyping and packaging processes by integrating the Mayku Mulitplier pressure former ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Fig 1. The system-in-package approach is part of the trend toward thinner and more integrated 3D IC packages for CPUs, GPUs, and FPGAs for use in camera modules and wireless products, where high ...