EAGAN, MN – May, 2015 – Ironwood Electronics' new high performance BGA Socket Adapter, LS-BGA1924A-05, allows user to convert compression mount BGA socket which needs mounting holes (in target PCB) ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

Users can socket their 1mm pitch, 64ball BGA devices without performance loss or little board space, no mounting holes, no solder EAGAN, MN—Ironwood Electronics' new high-performance ...

Mod5 Series flip-top BGA socket requires no tooling or mounting holes, maximizing PCB real estate while reducing costs. For test, debug, and validation of 0.5-mm pitch BGA devices, the Mod5 Series ...