Researchers from the City University of Hong Kong (CityUHK) have achieved a significant breakthrough in electronic packaging technology by developing an innovative nanocrystalline (NC) copper material ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...