SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
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