TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

Applied Materials (NasdaqGS:AMAT) has completed its acquisition of ASMPT NEXX, expanding its reach in advanced semiconductor ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

The ongoing rise of generative AI is driving the entire semiconductor industry toward unprecedented growth. The global semiconductor market is expected to exceed $1 trillion by 2030, with a strong 8.7 ...

TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits — tiny chips that convey information using light instead of ...