A new technical paper titled “Simulation of Vertically Stacked 2-D Nanosheet FETs” was published by researchers at Università di Pisa and TU Wien. “We present a simulation study of vertically stacked ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
A surprising number of people, if Internet forums are anything to go by, are of the belief that we are living inside a simulation. The idea, made popular by films like The Matrix, is pretty simple to ...
GPU-accelerated electromagnetic simulation is redefining how engineers design and validate antennas in complex, electrically ...
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