The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...

In today’s hyperconnected world, the average enterprise juggles more than a 1,000 applications—a number projected to increase dramatically as innovation accelerates. Research firm IDC estimates that 1 ...

Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic ...

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...

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How to create a data integration strategy for your organization Your email has been sent Despite the global digital acceleration of data use cases, many companies still struggle to be data-driven.