As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...
Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...
“Achieving yield and performance targets for advanced memory and logic devices requires very close monitoring of an exploding number of process parameters,” said Oreste Donzella, general manager of ...
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