IRVINE, Calif.–Newport Corp. today announced it has received a U.S. patent for a robotic system design that grips 300-mm wafers by their edges and reduces the risk of damage while moving silicon ...
Newport Corp. today said it has been awarded a U.S. patent for a 300mm edge-grip robotic end effector apparatus that allows semiconductor manufacturers to handle 300mm wafers by only their edges ...
Proprietary systems have traditionally dominated the control of three and four-axis wafer handling robots for in-vacuum and in-air wafer applications. As a result, these systems can be limited in ...