Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

Siemens Digital Industries Software has brought out a tool to rapidly provide transistor-level isolation for scan chain defects. For 5nm and better nodes where yield ramp heavily relies on chain ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be ...

SAN JOSE , USA: KLA-Tencor has introduced the eDR-5200, a new-generation wafer defect review and classification system that leverages advances in resolution and defect re-detection sensitivity, along ...