CAMPBELL, Calif.--(BUSINESS WIRE)--Sigrity, Inc., the market leader in signal and power integrity solutions, today introduced XcitePI IO Interconnect Model Extraction as part of the company’s ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

For chips designed at advanced technology nodes, interconnect is the dominant contributor towards delay, power consumption, and reliability. Major interconnects such as clock trees, power distribution ...

Advanced interconnect materials and technologies represent a pivotal aspect of modern integrated circuits, addressing both the miniaturisation of device architectures and the increasing performance ...

Integrated circuit (IC) designers move to advanced process technology nodes to leverage higher performance, density, and functionality, as well as reduced delay and power consumption, enabled by ...

CAMPBELL, Calif.-- May 14, 2012-- Sigrity, Inc., the market leader in signal and power integrity solutions, today introduced XcitePI IO Interconnect Model Extraction as part of the company’s ...