Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...

Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...