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In recent years, various die attach (DA) materials have been developed to cope with the higher power dissipation requirements of semiconductor devices. DA materials based on metals such as solder or ...
SAN DIEGO--(BUSINESS WIRE)--Kyocera America, Inc., Chemical Sales Division, today announced the U.S. introduction of its environmentally-friendly XT2773R7 Silver Sinter Paste, a proprietary ...
Sintered silver paste plays a pivotal role in the Semiconductor Silver Paste Market due to its superior thermal and electrical conductivity, making it ideal for die attach and power device ...
High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...
Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...
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Daisuke Koike, Masahiko Hori from Package Solution Technology Development Department, Electronic Devices & Storage Research Development Center, Toshiba Electronic Devices & Storage Corporation ...
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