Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

The complexities associated with the use of solders in electronic products. What’s the alternative to solder? A long-standing adage observes that “if the only tool in your tool chest is a hammer, the ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...