Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink. Both ASML and ...

An optical method for mask alignment in double-sided lithography has been developed by a team at the University of Hagen in Germany (Appl. Opt. 40 5052). The technique, which is based on the ...

ST. FLORIAN, Austria, July 6 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that ...

Hsinchu, Taiwan, R.O.C. – December 27, 2007 – Taiwan Semiconductor Manufacturing Company, Inc. today announced the foundry industry’s first multi-layer mask service (MLM) for 90nm, 80nm and 65nm ...

Chipmakers continue to migrate to the next node, but there are signs that traditional IC scaling is slowing down. So what’s causing the slowdown? Or for that matter, what could ultimately undo ? It ...