After previously trying out low-tech compression molding with a toaster oven and 3D printed molds, [future things] is back with a video that seeks to explore some of the questions raised after the ...

Over the decades, ASTM shear test methods, from lamina-level to multidirectional laminate-level, have continued to evolve as composite applications require higher shear strengths.

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...