On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...

NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.

When is a complex chip design ready to be shipped to manufacturing?

Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...

Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...

NAND in space; integrated photonic functions on silicon; light-emitting organic transistor with memory.

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods ...

This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...

We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the ...