Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and ...
Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)
A new technical paper titled “An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection” was published by Imec and SCREEN SPE Germany. “Deep learning-based semiconductor ...
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